: The duration the solder remains in a liquid state.
: Gradually increasing the temperature to avoid thermal shock to the PCB or components. IPC-7530
: Controlled cooling to determine the grain structure of the solder joint. Guidelines for Effective Profiling IPC-7530 Standard Only | electronics.org : The duration the solder remains in a liquid state
A compliant thermal profile typically consists of four critical phases: Guidelines for Effective Profiling IPC-7530 Standard Only |
The current version is (released January 2025), which expands beyond reflow and wave soldering to include vapor phase, laser, and selective soldering processes. Core Stages of a Thermal Profile
, officially titled Guidelines for Temperature Profiling for Mass Soldering Processes , is the industry standard for creating and managing thermal profiles in electronics manufacturing. It ensures that all solder joints reach the necessary temperatures for metallurgical bonding without damaging heat-sensitive components.
: Usually 20°C to 40°C above the solder's melting point.